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3D IC is Here—But Is Your Architecture Ready for It?

3D IC is Here—But Is Your Architecture Ready for It?

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 As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can survive and thrive in the new era of stacked silicon? In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Pratyush Kamal, Director of R&D for 3D IC Solutions Engineering at Siemens Digital Industries. With decades of experience spanning Qualcomm and Google, Pratyush brings deep insight into the evolution of IC design—and how 3D integration is transforming every layer of the design stack. From redefining how and when microarchitecture decisions are made to overcoming the thermal, testing, and failure analysis challenges that come with 3D stacking, this episode dives into the critical topics design teams need to understand today. You’ll also hear how AI, automation, and cross-disciplinary expertise are reshaping team roles—and why software-defined silicon is redefining the design process itself. This episode is essential listening for IC architects, system designers, and packaging engineers navigating the transition to advanced 3D IC platforms. What You’ll Learn in this Episode: What is microarchitecture in IC design? (2:30) What does microarchitecture mean in 3D IC design? (3:20) How early do we need to consider microarchitecture in 3D IC design? (4:45) The main issues system designers face concerning the increasing complexity of microarchitecture (5:50) How are roles changing to enable a more holistic outlook on 3D IC microarchitecture? (9:15) What would enable non-silo design practice? (11:00) Closing thoughts (11:55) Connect with John McMillan LinkedIn Website Connect with Pratyush Kamal LinkedIn Website Explore More on 3D IC Innovation & Research: Deepen your understanding of 3D IC design with these valuable resources: Home | UCIe Consortium Die Stacking (3D) Microarchitecture | IEEE Conference Publication | IEEE Xplore Fine grain 3D integration for microarchitecture design through cube packing exploration | IEEE Conference Publication | IEEE Xplore Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses | IEEE Conference Publication | IEEE Xplore Design-Aware Partitioning-Based 3-D IC Design Flow With 2-D Commercial Tools | IEEE Journals & Magazine | IEEE Xplore

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